Device and method for manufacturing emblem with incorporated IC chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 20, 2019
Grant Date -
Aug 3, 2017
app pub date -
May 2, 2014
filing date -
May 2, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
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US Family Size
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Non-US Coverage
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Abstract
A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| JP | B2 | JP6359092 | May 02, 2014 |
| WO | A1 | WO2015166584 | May 02, 2014 |
| EP | B1 | EP3138695 | May 02, 2014 |
International Classification(s)
- 2014 Application Filing Year
- B29C Class
- 4829 Applications Filed
- 3911 Patents Issued To-Date
- 80.99 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B29C Class
- 0 % this patent is cited more than
- 6 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 20, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 20, 2031 |
