Heat transfer chassis and method for forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10383261
APP PUB NO 20170112018A1
SERIAL NO

15222478

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.

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Patent Owner(s)

Patent OwnerAddress
GE GLOBAL SOURCING LLC901 MAIN AVENUE NORWALK CT 06851

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Theodore Clark Ripley, US 23 250
Krivonak, Andrew Louis Erie, US 37 211
Perlaguri, Shreenath Shekar Bangalore, IN 17 131
Radhakrishnan, Arunpandi Bangalore, IN 9 55
Rush, Brian Magann Niskayuna, US 40 290
Thiagarajan, Naveenan Niskayuna, US 25 157
Yammanuru, Rajendra Bangalore, IN 11 55

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