MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
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United States of America Patent
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Aug 13, 2019
Grant Date -
Dec 28, 2017
app pub date -
Jun 20, 2017
filing date -
Jun 27, 2016
priority date (Note) -
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Abstract
A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.
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