Busbar arrangement
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United States of America Patent
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Aug 6, 2019
Grant Date -
Jan 31, 2019
app pub date -
Nov 25, 2016
filing date -
Dec 22, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an overlap. The webs are oriented such as to define a first axis which runs through the connection element of an associated one of the webs and a point of a transition of the web to the overlap region of the busbar arrangement, and which intersects a second axis which is formed by a connection between two connection elements of the webs at an angle between 0° and 45°. The busbar arrangement includes an insulating region to reduce or prevent a current in the web in a direction perpendicular to the second axis. The overlap region and the webs are each located in one plane.
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