High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials
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United States of America Patent
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Aug 6, 2019
Grant Date -
Aug 24, 2006
app pub date -
Feb 21, 2006
filing date -
Feb 18, 2005
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Abstract
A method of making a virtual substrate includes providing a donor substrate comprising a single crystal donor layer of a first material over a support substrate, wherein the first material comprises a ternary, quaternary or penternary semiconductor material or a material which is not available in bulk form, bonding the donor substrate to a handle substrate, and separating the donor substrate from the handle substrate such that a single crystal film of the first material remains bonded to the handle substrate.
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