Sealing of optical module with O-ring and liquid resin

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10371369
APP PUB NO 20160033122A1
SERIAL NO

14796890

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Abstract

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An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided.

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Patent Owner(s)

Patent OwnerAddress
HITACHI-LG DATA STORAGE INC22-23 KAIGAN 3-CHOME MINATO-KU TOKYO 108-0022

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuichi, Hiroaki Tokyo, JP 33 225
Ichikawa, Fumihito Tokyo, JP 9 14
Ogasawara, Hiroshi Tokyo, JP 68 677
Okamura, Masayuki Tokyo, JP 16 94
Sakigawa, Yukio Tokyo, JP 6 76
Watabe, Kenji Hitachi, JP 43 362
Yamasaki, Tatsuya Tokyo, JP 70 420

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