Semiconductor device
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United States of America Patent
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Jul 23, 2019
Grant Date -
May 3, 2018
app pub date -
Sep 30, 2017
filing date -
Nov 2, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device includes a semiconductor element, a laminated substrate including an insulating board and a circuit board disposed on the insulating board, the semiconductor element being mounted on the circuit board, a surrounding case having an opening, and being disposed on the outer peripheral portion of the insulating board to surround the circuit board, a relay substrate having a through hole and being disposed on the surrounding case to cover the opening, and an external connection terminal including a first end portion bonded to the circuit board, a second end portion, opposite to the first end portion, inserted into the through hole of the relay substrate from the rear surface of the relay substrate so as to be in contact with the front surface of the relay substrate, and an elastically deformable elastic portion between the first end portion and the second end portion.
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