Spacer wafer for wafer-level camera and method for manufacturing same

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United States of America Patent

PATENT NO 10359609
APP PUB NO 20170168270A1
SERIAL NO

15445400

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Abstract

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A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.

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Patent Owner(s)

Patent OwnerAddress
OMNIVISION TECHNOLOGIES INC4275 BURTON DRIVE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barnes, George Westminster, US 10 63
Rauker, Goran Longmont, US 6 23

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