Composition for forming conductive pattern and resin structure having conductive pattern

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United States of America Patent

PATENT NO 10354774
APP PUB NO 20170140849A1
SERIAL NO

15317023

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Abstract

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The present invention relates to a composition for forming a conductive pattern that enables forming conductive micropatterns on various polymer resin products or resin layers by a simplified process without deformation of the polymer resin products or resin layers, and enables effectively satisfying requirements of the art, and a resin structure having a conductive pattern.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDYOUNGDUNGPO-GU SEOUL 150-721

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeong, Han Nah Daejeon, KR 25 37
Jun, Shin Hee Daejeon, KR 29 46
Kim, Jae Hyun Daejeon, KR 259 2059
Kim, Min Ji Daejeon, KR 68 152
Lee, Ha Na Daejeon, KR 45 350
Lee, Ryul Daejeon, KR 13 85
Park, Chee-Sung Daejeon, KR 18 35
Park, Cheol-Hee Daejeon, KR 79 245

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