Clamping device for soldering operations
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United States of America Patent
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Jul 2, 2019
Grant Date -
Jun 1, 2017
app pub date -
Oct 28, 2016
filing date -
Nov 30, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.
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