Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
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United States of America Patent
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Jun 25, 2019
Grant Date -
Feb 2, 2017
app pub date -
Jul 25, 2016
filing date -
Jul 27, 2015
priority date (Note) -
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Abstract
A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 μm, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 μm.
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