Injector for forming films respectively on a stack of wafers
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United States of America Patent
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Jun 11, 2019
Grant Date -
Jul 9, 2015
app pub date -
Mar 23, 2015
filing date -
Dec 14, 2012
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Abstract
An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided.
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