Pastes for thermal, electrical and mechanical bonding
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United States of America Patent
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Jun 4, 2019
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N/A
app pub date -
Mar 14, 2014
filing date -
Mar 15, 2013
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Abstract
A class of paste materials for thermal, and mechanical bonding, and in some cases electrical interconnection, of two solid surfaces includes particles and an organic vehicle which is partially or completely removed during processing. The paste includes hybrids of inorganic materials for meeting the thermal, electrical and mechanical bonding functionality requirements and organic materials for meeting the process, application and protection requirements. The inorganic materials include high thermal and optionally electrical conductivity materials in forms from nanoparticles to micro-powders. The organic materials may include small molecules, surfactant, oligomers, and polymers.
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