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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HENKEL IP & HOLDING GMBH	40589 DÜSSELDORF

International Classification(s)

• C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Wong, Raymond S	San Ramon, US	20	375
Zheng, Huabing	Concord, US	5	15

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 4, 2026
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 4, 2030

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 04, 2019	US,10308777,B2   US10308777B2	GRANTED PATENT AS SECOND PUBLICATION
July 07, 2016	US,20160194469,A1   US20160194469A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 10308777

Pyrolized organic layers and conductive prepregs made therewith

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