Laser fiber array for singulating semiconductor wafers
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United States of America Patent
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Jun 4, 2019
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May 5, 2016
app pub date -
Nov 5, 2014
filing date -
Nov 5, 2014
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Abstract
An apparatus for cutting a substrate comprises first and second lasers, and first and second optical fibers each having an input end and an output end opposite to the input end, wherein the input ends of the first and second optical fibers are connected to the first and second lasers respectively. The output ends of the first and second optical fibers are movable relative to the substrate and are configured to image first and second laser beams onto the substrate simultaneously for cutting the substrate.
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