Systems and methods for lead frame locking design features
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United States of America Patent
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May 14, 2019
Grant Date -
Nov 16, 2017
app pub date -
Aug 3, 2017
filing date -
Oct 20, 2011
priority date (Note) -
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Abstract
Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle.
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