Release layer for subsequent manufacture of flexible substrates in microelectronic applications
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United States of America Patent
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May 14, 2019
Grant Date -
Mar 10, 2016
app pub date -
Apr 29, 2014
filing date -
Apr 30, 2013
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Abstract
Compositions and methods are described for a release layer that is affixed directly onto a carrier or with the use of an interfacial adhesive layer to fabricate a flexible work product, and upon completion, the release layer is removed by an external applied force of a given value that overcomes the adhesive force without harm to the work product. The release layer serves as a permanent support for the manufacture of flexible electronic devices and upon completion offers a simple means to achieve a wide range of thin and ergonomically pleasing options for the consumer. The invention provides benefits of flexibility in choosing a host of materials to meet the needs of a specific manufacturing objective and rapidly moving towards the next step in the manufacture of semiconductors and flat panel displays.
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