Preclean and deposition methodology for superconductor interconnects
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 30, 2019
Grant Date -
Nov 22, 2018
app pub date -
May 17, 2017
filing date -
May 17, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is provided of forming a superconductor interconnect structure. The method comprises forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further comprises performing a cleaning process on the top surface of the dielectric layer and in the interconnect opening while in the deposition chamber, and depositing a superconducting metal in the interconnect opening while in the deposition chamber to form a superconducting element in the superconductor interconnect structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully