Semiconductor device packages and stacked package assemblies including high density interconnections

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10276382
APP PUB NO 20180047571A1
SERIAL NO

15615665

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Abstract

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A semiconductor device package includes an electronic device and a redistribution stack. The redistribution stack includes a dielectric layer disposed over an active surface of the electronic device and defining an opening exposing at least a portion of a contact pad of the electronic device. The redistribution stack also includes a redistribution layer disposed over the dielectric layer and including a trace. A first portion of the trace extends over the dielectric layer along a longitudinal direction adjacent to the opening, and a second portion of the trace is disposed in the opening and extends between the first portion of the trace and the exposed portion of the contact pad. The second portion of the trace has a maximum width along a transverse direction orthogonal to the longitudinal direction, and the maximum width of the second portion of the trace is no greater than about 3 times of a width of the first portion of the trace.

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Patent Owner(s)

Patent OwnerAddress
ADVANCED SEMICONDUCTOR ENGINEERING INC26 CHIN 3RD ROAD NANZIH DIST KAOHSIUNG 811

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, William T Kaohsiung, TW 25 548
Hung, Chih-Pin Kaohsiung, TW 71 813
Hunt, John Richard Kaohsiung, TW 9 225
Wang, Chen-Chao Kaohsiung, TW 41 351

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