Semiconductor strips with undercuts and methods for forming the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 23, 2019
Grant Date -
May 10, 2018
app pub date -
Jan 8, 2018
filing date -
Mar 12, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit device includes a semiconductor substrate, and a semiconductor strip extending into the semiconductor substrate. A first and a second dielectric region are on opposite sides of, and in contact with, the semiconductor strip. Each of the first dielectric region and the second dielectric region includes a first portion level with the semiconductor strip, and a second portion lower than the semiconductor strip. The second portion further includes a portion overlapped by the semiconductor strip.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully