Seamless sleeve and seamless substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 23, 2019
Grant Date -
Apr 30, 2015
app pub date -
Dec 29, 2014
filing date -
Feb 6, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2014 Application Filing Year
- B41N Class
- 46 Applications Filed
- 39 Patents Issued To-Date
- 84.79 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B41N Class
- 0 % this patent is cited more than
- 6 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 23, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 23, 2030 |
