Leaf spring fixing structure, electrical contact structure, and method for manufacturing these

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United States of America Patent

PATENT NO 10260587
APP PUB NO 20180259024A1
SERIAL NO

15755624

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Importance

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Abstract

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Provided is a plate spring fixing structure and the like which do not necessitate complex assembling processes and thus can reduce production cost and can be reduced in size, and which enable adjustment, during a production process, of the extent to which the plate spring is bent. A holding structure (1A) includes a first plate spring (12) that has: a fixed portion (12a) embedded in and fixed to a first molded resin part (11); and a spring portion (12b) which is not fixed and which has a spring property. The fixed portion (12a) has a face that is not in contact with the first molded resin part (11).

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Patent Owner(s)

Patent OwnerAddress
OMRON CORPORATIONKYOTO JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawai, Wakahiro Konan, JP 46 768

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