Modular split-processing infrared imaging system
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United States of America Patent
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Mar 12, 2019
Grant Date -
Jul 6, 2017
app pub date -
Mar 22, 2017
filing date -
Sep 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.
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