Method of producing semiconductor chips that efficiently dissipate heat
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United States of America Patent
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Mar 5, 2019
Grant Date -
Sep 21, 2017
app pub date -
Jun 6, 2017
filing date -
Feb 16, 2011
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Abstract
A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating the first major face from the second major face at least with regard to one polarity of an electrical voltage; c) arranging a semiconductor layer sequence on the first major face of the carrier substrate; and d) singulating the carrier substrate with the semiconductor layer sequence into a plurality of semiconductor chips.
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