Convertible floor panel assembly, composite floor structure, and method for filling an orchestra opening adjacent a theater stage

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United States of America Patent

PATENT NO 10221581
APP PUB NO 20170226761A1
SERIAL NO

15496592

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A convertible floor panel assembly incorporates a metal wire mesh subfloor and a polymer deck overlying the wire mesh subfloor. A plurality of alignment heads project from an underside of the polymer deck, and are designed to extend through respective mesh openings defined by the wire mesh subfloor. A plurality of panel retainers engage respective alignment heads, and are adapted for removably attaching the wire mesh subfloor and the polymer deck together. The floor panel assembly is thereby convertible between a substantially open-surface sound permeable safety structure and a continuous solid-surface structure for increased floor load capacity.

First Claim

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Patent Owner(s)

Patent OwnerAddress
PHILLIPS BRIAN OWOODRUFF SC

International Classification(s)

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  • 2017 Application Filing Year
  • E04B Class
  • 1369 Applications Filed
  • 982 Patents Issued To-Date
  • 71.74 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Phillips, Brian O Woodruff, US 2 6

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Patent Citation Ranking

  • 1 Citation Count
  • E04B Class
  • 46.19 % this patent is cited more than
  • 6 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3884261654101 - 1011 - 2021 - 3031 - 4051 - 600255075100125150175200225250275300325350375400425450

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