Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them
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United States of America Patent
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Mar 5, 2019
Grant Date -
Dec 20, 2018
app pub date -
Aug 18, 2017
filing date -
Jun 16, 2017
priority date (Note) -
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Abstract
The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular colloidal silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallyldimethylammonium salt, such as a diallyldimethylammonium halide, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallyldimethylammonium salt comprises a copolymer of diallyldimethylammonium chloride (DADMAC) and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
- G09G:ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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