Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

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United States of America Patent

PATENT NO 10219391
APP PUB NO 20170086305A1
SERIAL NO

15285752

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A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I),

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Patent OwnerAddress
ATOTECH DEUTSCHLAND GMBHBERLIN GERMANY BERLIN BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brooks, Patrick Berlin, DE 4 23
Brunner, Heiko Berlin, DE 34 113
Clicque, Arno Berlin, DE 5 11
Huelsmann, Thomas Berlin, DE 6 14
Sparing, Christian Berlin, DE 10 46
Zee, Adrian Berlin, DE 2 2

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