Stacked package module having an exposed heat sink surface from the packaging

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United States of America Patent

PATENT NO 10204882
APP PUB NO 20180082980A1
SERIAL NO

15826714

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Abstract

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A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

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Patent Owner(s)

Patent OwnerAddress
DELTA ELECTRONICS INCNO 252 SHANYING RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hong, Shou-Yu Taoyuan, TW 23 278
Liang, Le Taoyuan, TW 34 61
Zhao, Zhen-Qing Taoyuan, TW 10 32

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