Electronic device, and fabrication method and apparatus for manufacturing exterior member of the same

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United States of America Patent

PATENT NO 10203724
APP PUB NO 20160339679A1
SERIAL NO

15160481

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Abstract

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According to various embodiments of the present disclosure, there is provided a fabrication method for fabricating an exterior member of an electronic device. The fabrication method may include a film disposing step of disposing a film on an exterior member in which one face is formed as a first curved face, and a lamination step of laminating the film on the exterior member. The fabrication method as described above may be variously implemented according to embodiments.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Min-Su Seoul, KR 7 157
Choi, Jong-Chul Suwon-si, KR 76 762
Han, Soon-Ho Hwaseong-si, KR 6 31
Oh, Jeong-Hoon Yongin-si, KR 3 207
Yoon, Byoung-Uk Hwaseong-si, KR 51 1240

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