Method for producing cylindrical relief printing original plate

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United States of America Patent

PATENT NO 10195841
APP PUB NO 20160250840A1
SERIAL NO

15032952

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Abstract

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A method includes (i) preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm2; (ii) mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and (iii) applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40 ° C. so as to pressure-bond the overlapped area. The method may further include, after the step (iii), a step (iv) for photo-curing the uncured photosensitive resin layer and may further comprise, after the step (iv), a step (v) for grinding, abrading and/or machining the overlapped area.

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Patent Owner(s)

Patent OwnerAddress
TOYOBO MC CORPORATIONOSAKA UMEDA TWIN TOWERS SOUTH 13-1 UMEDA 1-CHOME KITA-KU OSAKA-SHI OSAKA 530-0001

International Classification(s)

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  • 2014 Application Filing Year
  • B41N Class
  • 46 Applications Filed
  • 39 Patents Issued To-Date
  • 84.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wada, Toru Okayama, JP 68 1292
Yawata, Yukimi Okayama, JP 10 39

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  • 6 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges413701 - 1002.557.51012.51517.52022.52527.53032.53537.54042.545

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