Photosensitive conductive paste, method of producing multilayer electronic component using the same, and multilayer electronic component
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United States of America Patent
Stats
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Jan 29, 2019
Grant Date -
Aug 17, 2017
app pub date -
May 2, 2017
filing date -
Nov 13, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A photosensitive conductive paste that contains (a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.
First Claim
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International Classification(s)
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- 2017 Application Filing Year
- C03C Class
- 1122 Applications Filed
- 751 Patents Issued To-Date
- 66.94 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C03C Class
- 0 % this patent is cited more than
- 6 Age
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|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 29, 2026 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 29, 2030 |
