Hot melt adhesive

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United States of America Patent

PATENT NO 10190027
APP PUB NO 20180355229A1
SERIAL NO

16106846

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Abstract

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The object of the present invention is to provide a hot melt adhesive which is less likely to cause stringing and has excellent thermal stability, and further has excellent adhesion, in particular adhesion to a paper substrate. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) a butyral resin, (C) an olefin-based polymer, and (D) a tackifier resin.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAAHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takamori, Ai Osaka, JP 23 33

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