Photoconductive switch package configurations having a profiled resistive element
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United States of America Patent
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Jan 15, 2019
Grant Date -
Jan 11, 2018
app pub date -
Jul 7, 2016
filing date -
Jul 7, 2016
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Abstract
Methods, systems, and devices are disclosed for photoconductive switch package configurations. In some aspects, a photoconductive switch package includes of a wide bandgap photoconductive material (e.g., GaN, ZnO, diamond, AlN, SiC, BN, etc.), a source for energetic photons (e.g., a laser), a mechanism to couple the laser into the switch, and a mechanism for high voltage to enter and leave the switch package. In some implementations, the disclosed photoconductive switch packages can be configured as a three terminal device, e.g., similar to transistors, with one of the terminals being laser input or the voltage input to the laser system.
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