Method and apparatus for laser cutting transparent and semitransparent substrates

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United States of America Patent

PATENT NO 10179374
APP PUB NO 20150367442A1
SERIAL NO

14765074

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Abstract

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The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.

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Patent Owner(s)

Patent OwnerAddress
NEWPORT CORPORATION1791 DEERE AVENUE IRVINE CA 92606

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bovatsek, James San Jose, US 11 659
Patel, Rajesh Fremont, US 98 1589

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