19-nor C3, 3-disubstituted C21-N-pyrazolyl steroids and methods of use thereof
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United States of America Patent
Stats
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Jan 8, 2019
Grant Date -
Aug 31, 2017
app pub date -
Oct 19, 2016
filing date -
Apr 17, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Provided herein are 19-nor C3,3-disubstituted C21-pyrazolyl steroids of Formula (I):
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SAGE THERAPEUTICS INC | 215 FIRST STREET CAMBRIDGE MA 02142 |
International Classification(s)

- 2016 Application Filing Year
- A61K Class
- 19101 Applications Filed
- 13019 Patents Issued To-Date
- 68.16 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Beresis, Richard Thomas | Shanghai, CN | 30 | 573 |
# of filed Patents : 30 Total Citations : 573 | |||
Harrison, Boyd L | Princeton Junction, US | 126 | 1642 |
# of filed Patents : 126 Total Citations : 1642 | |||
Martinez, Botella Gabriel | Wayland, US | 132 | 1511 |
# of filed Patents : 132 Total Citations : 1511 | |||
Robichaud, Albert Jean | Cambridge, US | 146 | 1755 |
# of filed Patents : 146 Total Citations : 1755 | |||
Salituro, Francesco G | Marlborough, US | 216 | 2924 |
# of filed Patents : 216 Total Citations : 2924 |
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- 12 Citation Count
- A61K Class
- 96.88 % this patent is cited more than
- 6 Age
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jul 8, 2026 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 8, 2030 |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent Application No: 12034425
High power, double-sided thin film filter
Abstract
A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.
Description
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