Electronic circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jan 1, 2019
Grant Date -
Oct 12, 2017
app pub date -
Dec 16, 2016
filing date -
Apr 12, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.
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