Method for metalizing vias

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United States of America Patent

PATENT NO 10165681
APP PUB NO 20150282318A1
SERIAL NO

14416916

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Abstract

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A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

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Patent Owner(s)

Patent OwnerAddress
CERAMTEC GMBHGERMANY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Herrmann, Klaus Thiersheim, DE 36 411
Thimm, Alfred Wunsiedel, DE 21 114

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