Method of forming wiring pattern and etching apparatus for forming wiring pattern
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United States of America Patent
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Dec 25, 2018
Grant Date -
Oct 6, 2016
app pub date -
Mar 31, 2016
filing date -
Apr 2, 2015
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A method of forming a wiring pattern includes: a) forming a metal underlayer including a first underlying wiring layer which is in contact with an electrode, a second underlying wiring layer which is not in contact with the electrode, and an underlying connection layer which connects the first underlying wiring layer to the second underlying wiring layer; b) forming a metal plating layer on the metal underlayer through electroplating; and c) removing a metal connection portion through etching. The metal connection portion is the underlying connection layer covered with the metal plating layer. The etching includes bringing a solid electrolyte material that contains a solution into which metal of the metal connection portion is dissolved, into contact with the metal connection portion and applying a voltage between the metal connection portion and the solid electrolyte material.
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- C25F:PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIAL....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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