Package structure for ultraviolet light-emitting diode
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United States of America Patent
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Dec 11, 2018
Grant Date -
Feb 15, 2018
app pub date -
Aug 11, 2016
filing date -
Aug 11, 2016
priority date (Note) -
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Abstract
The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.
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