Method for metalizing polymer substrate and polymer article prepared thereof

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United States of America Patent

PATENT NO 10138557
APP PUB NO 20160326652A1
SERIAL NO

15217681

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Abstract

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A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.

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Patent Owner(s)

Patent OwnerAddress
BYD COMPANY LIMITEDNO 3009 BYD ROAD PINGSHAN SHENZHEN 518118

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gong, Qing Shenzhen, CN 137 2449
Sun, Yongliang Shenzhen, CN 6 7
Zhou, Wei Shenzhen, CN 770 4458

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