Method of manufacturing case frame and electronic device having it

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United States of America Patent

PATENT NO 10133309
APP PUB NO 20140355208A1
SERIAL NO

14290194

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a case frame is provided. The method includes forming a mold for forming an ultraviolet molding pattern layer, laminating a hard coating layer on a transfer resin film, laminating an ultraviolet molding pattern layer on the hard coating layer, laminating a deposition layer on the ultraviolet molding pattern layer, laminating a printing layer on the deposition layer, and performing transfer IMD on an injection product using a transfer resin film, on which the printing layer, the deposition layer, the ultraviolet molding pattern layer, and the hard coating layer are successively laminated.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Min-Su Incheon, KR 7 157

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