Printed circuit board, optical module, and transmission equipment
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United States of America Patent
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Nov 13, 2018
Grant Date -
Sep 21, 2017
app pub date -
Mar 16, 2017
filing date -
Mar 18, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a first signal line inside a first dielectric layer; a first ground conductor layer and a second ground conductor layer; a second signal line disposed on the first ground conductor layer; a signal via for connecting the first signal line and the second signal line; and ground vias formed surrounding the signal via. The ground vias include first ground vias formed at respective first points, second ground vias formed at respective second points. The first points are placed on the line of a first polygon, and the second points are placed on the line of a second polygon, and the distances between adjacent first points and those between adjacent second points are all equal to or shorter than a first distance, and at least one second point is placed within the first distance from each of the adjacent first points.
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