Flexible circuit board and method for manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 30, 2018
Grant Date -
N/A
app pub date -
Aug 30, 2017
filing date -
Aug 30, 2017
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates to a flexible circuit board. The flexible circuit board includes a first conductive trace substrate and a third conductive layer, a second conductive post and a third conductive post. The first conductive trace substrate includes a first insulating layer, a first conductive layer and a second conductive layer formed two opposite surfaces of the first insulating layer. The first conductive layer includes a first signal line, the second conductive layer includes a second signal line, and the first signal line is parallel connected with the second signal line.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully