Conductive composition

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United States of America Patent

PATENT NO 10113079
APP PUB NO 20170190930A1
SERIAL NO

15312729

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Abstract

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The present invention relates to a conductive composition, and more particularly, to a conductive copper ink or paste composition for forming fine pattern which comprises a metal precursor and copper powder to increase the density of metal pattern formed during sintering and improve surface roughness, thereby being capable of achieving excellent electrical conductivity, adhesion strength to a substrate, and printability.

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Patent Owner(s)

Patent OwnerAddress
DONGJIN SEMICHEM CO LTDSEO-GU INCHEON 404-205

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Ju Kyung Seongnam, KR 2 6
Kim, Kyung Eun Seongnam, KR 29 101
Kim, Young Mo Seongnam, KR 38 135
Lee, Seung Hyuk Seongnam, KR 10 94
Yoo, Hyun Seok Seongnam, KR 5 10

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