Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates
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United States of America Patent
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Oct 16, 2018
Grant Date -
Mar 5, 2015
app pub date -
Aug 28, 2014
filing date -
Aug 28, 2013
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Abstract
A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.
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