Structured adhesive layer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10100227
APP PUB NO 20150218423A1
SERIAL NO

14424270

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Abstract

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The invention relates to the use of an adhesive tape to adhesively bond printing plates, during which the impairment of the adhesive bonds by air bubble inclusions between the adhesive tape and a substrate should be reduced. This is achieved by using an adhesive tape comprising at least one adhesive layer, wherein the adhesive layer has at least one groove that does not extend to one of the edges of the adhesive layer, and the portion of the entire groove volume of the adhesive layer that is associated with such grooves is more than 50%.

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Patent Owner(s)

Patent OwnerAddress
TESA SENORDERSTEDT GERMANY NORDERSTEDT SCHLESWIG-HOLSTEIN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ebenau, Steffen Hamburg, DE 2 3
Thebud, Nils Lüneburg, DE 14 220

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