Electrodeposited nano-twins copper layer and method of fabricating the same
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United States of America Patent
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Oct 9, 2018
Grant Date -
Dec 8, 2016
app pub date -
Aug 16, 2016
filing date -
Nov 16, 2011
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Abstract
An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
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