MEMS double-layer suspension microstructure manufacturing method, and MEMS infrared detector
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 9, 2018
Grant Date -
May 17, 2018
app pub date -
May 10, 2016
filing date -
May 13, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An MEMS double-layer suspension microstructure manufacturing method, comprising: providing a substrate; forming a first dielectric layer on the substrate; patterning the first dielectric layer to prepare a first film body and a cantilever beam connected to the first film body; forming a sacrificial layer on the first dielectric layer; patterning the sacrificial layer located on the first film body to make a recess portioned portion for forming a support structure, with the first film body being exposed at the bottom of the recess portioned portion; forming a second dielectric layer on the sacrificial layer; patterning the second dielectric layer to make the second film body and the support structure, with the support structure being connected to the first film body and the second film body; and removing part of the substrate under the first film body and removing the sacrificial layer to obtain the MEMS double-layer suspension microstructure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully