Heat transferring arrangement
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United States of America Patent
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Oct 2, 2018
Grant Date -
Dec 18, 2014
app pub date -
Jan 20, 2013
filing date -
Apr 5, 2012
priority date (Note) -
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Abstract
The present invention relates to a heat transferring arrangement (100, 400) for cooling at least one light emitting diode (302), wherein the heat transferring arrangement (100, 400) comprises a centre portion (102, 402) configured for mounting the light emitting diode (302) and adapted to receive heat generated from the light emitting diode (302) when emitting light, and a plurality of elongated heat transferring elements (104), each having a first end portion (106) connected to the center portion (102, 402) and a second end portion (108) which when inserted in a housing (200) is configured to be in abutment with an inner surface (202) of the housing (200), so that the generated heat is thermally transferred to the housing (200). Advantages with the invention includes, at least, that a passive heat transferring arrangement is provided which may reduce the need of an external fan or membranes to provide sufficient cooling.
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