Floating wafer chuck
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United States of America Patent
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Sep 25, 2018
Grant Date -
N/A
app pub date -
Jul 18, 2017
filing date -
Jul 18, 2017
priority date (Note) -
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Abstract
Edge grippers are disposed around an outer edge of a chuck. Each of the edge grippers includes a finger configured to pivot around a point; a contact pad configured to contact the wafer; and a flexure disposed between the contact pad and the finger. The flexure is configured to flex toward and away from the chuck. The chuck can use a matrix of vacuum and pressure nozzles designed to keep a wafer floating above the chuck. The edge grippers can hold the wafer at the edge while minimizing deformation of the wafer or without affecting z-jitter of the wafer.
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